Loc: San Francisco, CA
The MDD case is metal with plastic face plates on the sides and front. Does anyone know the clearance between the plates and the metal? Could you fit some dampening pads in there (possibly 4mm thick)? Or, would it be better to put them inside, possibly under the mother board or something?
Speaking of under the motherboard... I saw mod from a guy who I think was in the UK and when he took everything out to clean the case and overclock, he decided to put a clear sheet of some sort of low-/no-static plastic under the motherboard because of some kind of paranoia that it wouldn't ever sit in the right spot again so he didn't want it to directly touch the case. Is this actually a concern? Does the motherboard not have a set of stumps or guides of another sort to rest on?
Also, does anyone know if it's worth the minor trouble to add heatsinks to the various chips on the mobo? I've seen things like northbridge heatsinks (some crazy looking ones too!) and people do put 'em on the memory chips of graphics cards. What about some of those other myriad chips? Maybe they just never generate any amount of heat worth speaking of.
Some of the mods I wanted to do, like replacing the ribbon cables for the HDDs, I may put off 'til the rest of the work is done.
Did I mention in any of my older posts that I have zero intention of changing the case of my MDD? Well, aside from moving the tower's speaker, since it's almost 100% useless to me.
Anyway... As always, thanks for any answers!
DP 1.08GHz PMG4 MDD, 1GB PC2700 DDR, 200GB ATA (16MB, 7200RPM), Radeon 9800 Pro (256MB)
If you mean pads for dampening sound, I expect you could fit a layer of Dynamat or similar in there behind the plastics. I would have conserns about heat doing something like that though. I believe adding heatsinks to the chipset can be beneficial when overclocking (especially the system bus). It certainly won't do much harm if you do it right (supergluing bits of metal onto chips is not advised for example). The memory controller in particular will get quite warm in some systems.
The motherboard should sit happily on its standoffs. The build quality of Apple's cases is second to none. You needn't worry about shielding the back wall of the case.
Xplain's use of MacNews, AppleCentral and AppleExpo are not affiliated with Apple, Inc. MacTech is a registered trademark of Xplain Corporation. AppleCentral, MacNews, Xplain, "The journal of Apple technology", Apple Expo, Explain It, MacDev, MacDev-1, THINK Reference, NetProfessional, MacTech Central, MacTech Domains, MacForge, and the MacTutorMan are trademarks or service marks of Xplain Corp. Sprocket is a registered trademark of eSprocket Corp. Other trademarks and copyrights appearing in this printing or software remain the property of their respective holders.
All contents are Copyright 1984-2010 by Xplain Corporation. All rights reserved. Theme designed by Icreon.